Description

Warpage Measurement of Simulated Electronic Packaging Assembly.- Nanomechanical Characterization of Lead Free Solder Joints.- In-Situ Surface Mount Process Characterization Using Digital Image Correlation.- Acoustic Waveform Energy as an Interconnect Damage Indicator.- Shape Optimization of Cantilevered Piezoelectric Devices.- Unique Fabrication Method for Novel MEMS Micro-contact Structure.- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms.- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.- MEMS Cantilever Sensor Design for Photoacoustic Detection of Terahertz Radiation.- In-Plane MEMS Acoustic Emission Sensors Development and Experimental Characterization.- New Insight into Pile-Up in Thin Film Indentation.- Mapping the Mechanical Properties of Alloyed Magnesium (AZ 61).- Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films.- Molecular Interactions on InxGa1-xN.- Timoshenko Beam Model for Lateral Vibration of Liquid-Phase Microcantilever-Based Sensors.- Improvement in Uncertainty of Tuning Fork-based Force Sensor Stiffness Calibration via the Indentation Method Using Direct Determination of Contact and Machine Compliance.- Flexible Terahertz Metamaterials for Frequency Selective Surfaces.